Soldering
This community is for electronic hobbyists to discuss projects and is focused on soldering. Everyone is welcome from the noob to people who have been soldering as a hobby for decades to people who solder professionally. We'll talk about materials and techniques, equipment, and projects. Everyone is welcome. All questions are welcome. Post photos and ask for help.
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All Lemmy.ca rules apply here.
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Everyone (see rule 98) is welcome.
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[Did you actually think there were 98 rules?]
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A tip with wide surface area is good for quick transfer of heat to the piece. It avoids the situation where you’re sitting there with the iron in prolonged contact while the temperature of surrounding areas / adhesives steadily increases while the solder doesn’t wet.
Low melt can be helpful, I recommend against using it for anything where a mechanical mount is needed (HDMI, DC Jacks, USB Receptacles, etc) or for high temperature applications (e.g automotive) Once the bismuth is bound to a pad it’s almost impossible to get off without sanding/grinding, it permanently reduces the melting point in that area and increases the chance of losing that mechanical bond.
In case it wasn’t clear, the advice I outlined is to prevent burning the pad off in the first place. Once you’ve damaged pads / traces / vias you’re in restoration / workaround territory.
I understand, thank you.
The reason I burned the via was because I couldn't get the old solder out and didn't know how to do it safely. Sounds like the solution is to pre-heat the board, use leaded solder, and try a larger/different tip.
What I shouldn't do is use low melt or just keep increasing the temperature.